Substrate Materials

Expand your range of substrates available for fabrication using electroless and electrolytic plating

Component Surfaces brings a wealth of plating Materials Science expertise for fabrication of your products. Combining our knowledge and experience in cleaning, etching, activating and plating technologies, processing is available for a variety of substrate materials including but not limited to:

 

Metals including alloys and composites of:

  • Aluminum
  • Copper
  • Iron
  • Nickel
  • Stainless Steel
  • Tungsten
  • Molybdenum
  • Titanium
Metal-Patterned Ceramics
  • HTCC and LTCC substrates and assemblies
  • Direct Bond Copper and Active Brazed Copper
  • Thin-film patterned ceramics & glasses
Non-conductive Materials including varieties of:
  • Ceramics
  • Plastics (Teflon & other fluoropolymers, ABS, PVC, Ultem, etc.)
  • Graphite

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  • High-Performance Base Materials
  • Thermal Management Materials
  • Metallic Coatings
  • Plastic Materials
  • Ceramic Materials

Non-Conductive Plating Options:

Plating a whole new range of materials.

As the evolution of power electronics in medical, military and industrial applications continues, advancements in processing technologies have created a whole new range of plating options for non-conductive materials.

From plastics and ceramics to glasses and graphites, metal deposits can now be applied to an expanding list of high-performance materials for electrical, thermal and manufacturing improvements.

Explore new surface and plating options with our materials scientists and chemical engineers. Component Surfaces has proven capabilities in a wide variety of materials and applications.